BGA REWORK

Our BGA rework system ensures that all the most challenging requirements from the users are addressed with precision and process safety in electronic assembly rework applications. It contains an 1,800 W high-performance hybrid heating element which can be used to desolder and solder SMT components of dimensions up to 70 x 70 mm.

BGA REWORK

Our BGA rework system ensures that all the most challenging requirements from the users are addressed with precision and process safety in electronic assembly rework applications.

It contains a 1,800 W high-performance hybrid heating element which can be used to desolder and solder SMT components of dimensions up to 70 x 70 mm!

Our BGA rework system also offers a complete in-house service package, which cuts down the time drastically and also increases the production efficiencies.

BGA REWORK VIDEO

Our BGA rework system also offers a complete in-house service package, which cuts down the time drastically and also increases the production efficiencies.

Play Video