Our BGA rework system ensures that all the most challenging requirements from the users are addressed with precision and process safety in electronic assembly rework applications. It contains an 1,800 W high-performance hybrid heating element which can be used to desolder and solder SMT components of dimensions up to 70 x 70 mm.
Our BGA rework system ensures that all the most challenging requirements from the users are addressed with precision and process safety in electronic assembly rework applications.
It contains a 1,800 W high-performance hybrid heating element which can be used to desolder and solder SMT components of dimensions up to 70 x 70 mm!
Our BGA rework system also offers a complete in-house service package, which cuts down the time drastically and also increases the production efficiencies.
Our BGA rework system also offers a complete in-house service package, which cuts down the time drastically and also increases the production efficiencies.
