Altest’s Capabilities

Altest constantly upgrades its infrastructure to cater to all types of PCBA. Our multi-flex assembly lines, flying probe testers, traceability software and onsite component warehouse, are a few of our advanced infrastructures that standout as a testimonial to this. 

Assembly Capabilities

Altest focuses on providing hassle free, end-to-end PCBA service by addressing every challenge with an innovative and systematic approach. We also ensure rapid turnaround time without any compromise on the quality and functionality of the product. We continue to extend our services towards improving the capabilities of connected smart factories.

Feature

Capability

Information

Bare board baking

Max board size

25"X72"

PCB spec requirements

PCB min thickness

PCB max thickness

Max board size

Standard assy lead time

Expedite assy lead time

Facility shifts

0.015"

1.50"

25"X72"

5 days

1 day

1

Assembly types

Surface mount

Thru-hole

Mixed technology (SMT & Thru-hole)

Single or double sided placement

Conformal coating

Shield cover assembly for EMI emission control

Hand soldering capability

Facility shifts

12 SMT

2 T/H

Yes

Yes

Yes

Yes

Yes

Yes

Solder type

Lead-free - RoHS

Tin/Lead 37/63

Other Type(s)

Yes

Yes

No clean solder

Component type assembly capability

SMT 01005 or larger

Package size down to 0201

BGA devices and BGA connectors

IC pin to pin for 0.35mm pitch

RF cables and RF components

Stiffeners

Press-fit components

MLO/BGA Attachments

DUT socket or docking unit

Conical Inductors

Double and triple stack components (caps, resistors)

Cable & wire (what types?)

Yes

Yes

Yes

Yes

Yes both

Yes

Yes

Yes

Yes

Yes

Yes

Yes by hand

Yes any type

SMT parts presentation

Bulk

Cut tape

Partial reel

Reel

Tube

Tray

Not recommended

Yes

Yes

Yes

Yes both

Yes

Stencils

Laser-cut stainless steel

Non-stencil process capable

Yes

Yes

Cleaning methods

Ultrasonic capable

DI water

In-line cleaning or batch

Yes

Yes

Yes

Inspections

100% AOI test and X-ray (3D/5D) test for BGA

Incoming Inspection available

Ionograph cleaning test

Digital Microscope Capable

Flying Probe Test Capable

In Circuit Testing

Functional Testing

Yes

Yes

No

Yes

Yes

No

Yes

Rework capabilities

Trace cutting

Hand-wiring

Mini solder fountain

BGA rework station

Gold rework capacity
Hand-soldering

Yes

Yes

Yes

Yes

Yes

Yes

Certifications

IPC 610D certified personnel

Other certifications

Yes

AS9100/ISO 13484 Medical

Analytical capabilities

Failure analysis tools

No

Flying probe test capabilities

In-house FPT

Yes