Fabrication
Altest’s PCBA capabilities paired with the highest quality PCB boards ensure the exceptional end-products we deliver.
PCB
- Multilayer up to 60+ layers
- Embedded passives
- Heavy copper up to 10 oz.
- Over 50 UL approved laminates
- Thickness up to 0.450"
- Thin core dielectrics
- Dimensions up to 30" x 54"
- Mixed dielectrics
RF & Microwave
- High frequency/bandwidth designs
- Dielectric foam
- Planar and screened resistors
- Conductive paste
- Dimensions up to 24” x 48”
- Mixed dielectrics (hybrids)
- Plated cavities
- Formed (conformal) PCBs
- Optical machining
HDI
- Up to 12L “any layer” stacked uVia Structure
- 1.6 / 2.0 mil / space
- Wide material and surface finish selections
- 3/7 mil uVia / Pad size
- 14 mil, 6L ultra-thin structure
- Embedded, distributed and discrete passive components
- 0.4 mm pitch BGA with 2 traces fanout
Thermal Management
- Passive and active designs
- Buried metal core constructions
- Externally mounted heatsinks
- Epoxy and B-stage films
- Thermal & conductive bonding
- Aluminum & copper base materials
Flex & Rigid-Flex
- Type 2, 3 and 4 (double-sided, multilayer and rigid-flex)
- Epoxy fillet Bikini cut, bookbinder and loose-leaf construction
- Acrylic, epoxy and adhesive-less polyimide flex materials
- 30+ layers
- Dimensions up to 24" x 48"
- Combination surface finishes
- Over 50 rigid material options
- Thickness up 0.300"
IC Substrate
- 2,4,6 Layers (2+2+2 stacked via)
- BT material
- Type: SIP,CSP,BOC & FC package
- Flip chip C4 pad
- Fine trace width/space 25/25um
- Thin board: 130um(2L), 170um(4L)
- Wire bonding (ENEPIG, Soft gold, Hard gold)
Mixed Materials
- Passive and active designs
- Buried metal core constructions
- Externally mounted heatsinks
- Epoxy and B-stage films
- Thermal & conductive bonding
- Aluminum & copper base materials
- Various surface finishes
Multi Layer
- Acrylic, epoxy and adhesive-less polyimide flex materials
- Over 50 rigid material options
- Thickness up 0.300”