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  • 2 KOH YOUNG Solder Paste Inspection Machines
  • Ensures the accurate deposition of solder paste by detecting misalignment, insufficient paste, or excessive deposits early in the process.
  • Prevent defects like solder bridges or open circuits, reducing rework and scrap rates.
  • SPI improves production quality, enhances process control, and ensures consistent solder joint reliability, ultimately saving time and costs in high-volume manufacturing.

 

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